Nippon Denkai, Ltd.

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History

October
1958
Nippon Denkai, Ltd. was established in Kyoto by three corporations, Hitachi, Ltd., Sumitomo Bakelite Co., Ltd., and Kosoku Denki Chuzo Co., Ltd.
December
1958
Began the research and development of electrodeposited copper foil for printed circuit boards.
July
1961
Established a new plant in Shimodate-shi (currently Chikusei-city), Ibaraki Prefecture.
January
1983
Established a new plant in Fujieda-city, Shizuoka Prefecture.
October
1984
Established a second plant (current head office) in Shimodate-city, Ibaraki Prefecture.
November
1985
Closed Kyoto Plant
1989 Began the sales of electrodeposited copper foil for IC substrate.
1996 Began the sales of electrodeposited copper foil for LIB negative current collector.
June
1998
Began the sales of electrodeposited copper foil for LIB.
1999 Began the sales of electrodeposited copper foil for EMS of PDP.
January
2002
Moved the head office to Shimodate-city, Ibaraki Prefecture.
September
2002
Closed Fuijeda Plant.
December
2002
Began the sales of electrodeposited copper foil for super fine FPC.
June
2006
Began the sales of ultra-thin copper foil with carrier.
November
2012
Began the sales of high tensile strength copper foil.
July
2016
Stockholder change: MSD Investments Ltd. acquired Nippon Denkai, Ltd.
June
2018
Increased the manufacturing lines for EV battery copper foil.
October
2019
Nippon Denkai, Ltd. was merged into Nippon Denkai Holdings Ltd., and changed the trade name to Nippon Denkai, Ltd.
March
2020
Acquired Oak-Mitsui Inc., a copper foil manufacturer in the U.S., and changed the trade name to Denkai America Inc.
June
2021
Listed on the Tokyo Stock Exchange Mothers.(Now:Growth since April 2022)